Microphone Windscreens, Mic-Muff's, Microphone Accessories

An American Manufacturing Company Since 1976

Manufactured And Distributed By The Olsen Audio Group, Inc.

600 Series

Large Headset – Standard Foam
Inside Diameter: 1.000″ (25 mm)
Inside Depth: 1.750″ (44 mm)
Overall Height: 2.625″ (70 mm)
Overall Diameter: 2.000″ (51 mm)
Packaging: Single Pack, 3-Pack or Bulk (700 Series)
Colors Available: 1 – 22
 
Can be used over the 500, 10376 & 10377 windscreens.

600 Series Windscreens Fit the Following Microphones:
AKG C1000S. Audio Technica AE5100, PR06, ATM10a, ATM33a. Beyer M58, 64, 111, 201, 640. CK703, MC722, 724. MCE81, 91, Opus 83. M420, 422, 640. CAD ICM 417. Earthworks SR20, SR30, SR30/HC. Electro Voice D054, 635A, 636, PL37, RE10, RE15, RE55, RE200, CO15P, CS15P. Rode M3, NT3. Royer R-121, SF-1. Sennheiser e604, MD22, MD214, MKH40, MKH80, MKH800. Shure SM57, SM63, PE65, PE66, SM94, 849, AMS24, 545, 515, 562, 503, BG4.0, 4.1, 5.1, Prologue 10, 2L, 8L. Sony MS-907.

And most larger headsets and “straight” type (i.e. SM-57) and smaller ball type microphones up to 1.25″ (32mm) in diameter. *

Large Headset – Standard Foam
Inside Diameter: 1.000″ (25 mm)
Inside Depth: 1.750″ (44 mm)
Overall Height: 2.625″ (70 mm)
Overall Diameter: 2.000″ (51 mm)
Packaging: Single Pack, 3-Pack or Bulk (700 Series)
Colors Available: 1 – 22
 
Can be used over the 500, 10376 & 10377 windscreens.

600 Series Windscreens Fit the Following Microphones:
AKG C1000S. Audio Technica AE5100, PR06, ATM10a, ATM33a. Beyer M58, 64, 111, 201, 640. CK703, MC722, 724. MCE81, 91, Opus 83. M420, 422, 640. CAD ICM 417. Earthworks SR20, SR30, SR30/HC. Electro Voice D054, 635A, 636, PL37, RE10, RE15, RE55, RE200, CO15P, CS15P. Rode M3, NT3. Royer R-121, SF-1. Sennheiser e604, MD22, MD214, MKH40, MKH80, MKH800. Shure SM57, SM63, PE65, PE66, SM94, 849, AMS24, 545, 515, 562, 503, BG4.0, 4.1, 5.1, Prologue 10, 2L, 8L. Sony MS-907.

And most larger headsets and “straight” type (i.e. SM-57) and smaller ball type microphones up to 1.25″ (32mm) in diameter. *